Change with the Reactive Deposition Mode in Crystallographic and Mechanical Properties of Titanium Aluminum Nitride Coatings Obtained Via Grid-Assisted Magnetron Sputtering

Thin films of titanium aluminum nitride (Ti(1-x)AlxN) were deposited on silicon, copper, and plasma nitrided AISI D2 tool steel substrates through reactive direct current grid-assisted magnetron sputtering. The depositions performed in the metal compound modes using nitrogen flow rates (7.2 ± 0.1) sccm (6.8 0.2) sccm, respectively. relations between process parameters crystallographic orientation investigated. Chemical mechanical properties characterized by X-ray photoelectron spectroscopy (XPS), diffraction (XRD), scanning electron microscopy (SEM), transmission (TEM), instrumented indentation technique (IIT). spectra patterns revealed presence a Ti(1-x)AlxN phase with face-centered cubic structure both films. In mode, coatings exhibited preferential (111) plane orientation, changing to (200) mode. change was influenced gas partial pressure.